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| SI9430DY June 1999 DISTRIBUTION GROUP* SI9430DY Single P-Channel Enhancement Mode MOSFET General Description This P-Channel Enhancement Mode MOSFET is produced using Fairchild Semiconductor's advance process that has been especially tailored to minimize on-state resistance and yet maintain superior switching performance. This device is well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required. Features -5.8 A, -20 V. RDS(on) = 0.050 @ VGS = -10 V RDS(on) = 0.090 @ VGS = -4.5 V. Low gate charge. Fast switching speed. High power and current handling capability. Applications Battery switch Load switch Motor controls ' ' ' ' 62 6\PERO W'66 W*66 D' 6 6 6 * $EVROXWH 0D[LPXP 5DWLQJV 9hvTprAWyhtr BhrTprAWyhtr 9hvA8r AAAAAAAU$2!$ 8AyrAurvrArq R 3DUDPHWHU 5DWLQJV ! 8QLWV W W 6 ! AAAAAAAAAAAAAAAAAAAAAAIrA h A8vA AQyrq $' ! Q' QrA9vvhvAsA9hyAPrhvAAAAAAAAAAAAAAIrA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAIrA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAIrA h i p !$ ! $$AA $ X U-AU67* PrhvtAhqAThtrAEpvAUrrhrAShtr 8 7KHUPDO &KDUDFWHULVWLFV S-$ S-& UurhyASrvhprAEpv6ivr UurhyASrvhprAEpv8hrAAAAAAAAAAAAIrA $ !$ 8X 8X 3DFNDJH 0DUNLQJ DQG 2UGHULQJ ,QIRUPDWLRQ 9rvprAHhxvt (#" 9rvpr Tv(#"9 SrryATvr " UhrAvqu ! 4XDQWLW\ !$Av 9vrAhqAhshpvtAprAiwrpAApuhtrAvuAvAvsvphv (c)1999 Fairchild Semiconductor Corporation SI9430DY Rev. A SI9430DY (OHFWULFDO &KDUDFWHULVWLFV 6\PERO 7W9TT U A2A!$8AyrAurvrArq $ 3DUDPHWHU 9hvTprA7rhxq Wyhtr 7HVW &RQGLWLRQV WBTA2AAWAD9A2A!$A 0LQ ! 7\S 0D[ 8QLWV W 2II &KDUDFWHULVWLFV 7W U D9TT 9TT 6 7rhxqAWyhtr UrrhrA8rssvpvr arABhrAWyhtrA9hv 8r D9A2A!$A 6SrsrrprqAA!$8 % W 8 E W9TA2A %AWAWBTA2AAW W9TA2A AWAWBTA2AAWAUEA2A& 8 WBTA2A!AWAW9TA2AAW $ 6 6 DBTTA Bhr7qAGrhxhtrA8r Ahq DBTTS Bhr7qAGrhxhtrA8r Srrr WBTA2A!AAWAW9TA2AAW 6 2Q &KDUDFWHULVWLFV WBTu IrA! BhrAUuruyqAWyhtr BhrAUuruyqAWyhtr UrrhrA8rssvpvr ThvpA9hvTpr PSrvhpr W9TA2AWBTAD9A2A!$A D9A2A!$A 6 "$ W W 8 W U BTu 6SrsrrprqAA!$8 E S9T WBTA2A AWAD9A2A$"A6 WBTA2A%AWAD9A2A"%A6 WBTA2A#$AWAD9A2A!A6 "' #% %# ! $ $ % ( D9 PThrA9hvA8r WBTA2A AWAW9TA2A$AW WBTA2A#$AWAW9TA2A$AW 6 tAT AhqAUhpqphpr W9TA2A $AWAD9A2A$"A6 T '\QDPLF &KDUDFWHULVWLFV 8v 8 8 DA8hhpvhpr PA8hhpvhpr SrrrAUhsr 8hhpvhpr W9TA2A AWAWBTA2AAW sA2A AHC ($ % !! A A A 6ZLWFKLQJ &KDUDFWHULVWLFV q qss s UPA9ryhAUvr UPASvrAUvr UPssA9ryhAUvr UPssAAhyyAUvr 9hvTprASrrr SrprAUvr Rt Rt Rtq UhyABhrA8uhtr BhrTprA8uhtr Bhr9hvA8uhtr IrA! W99A2A AWAD9A2A A6ASGA2A WBTA2A AAWAS B@IA2A%A A ( ! ! ' " % ! T DAA2A!#A6AqvqA2A 6 !& " ( W9TA2A AWAD9A2A$"A6 WBTA2A AW $ 8 8 8 'UDLQ6RXUFH 'LRGH &KDUDFWHULVWLFV DQG 0D[LPXP 5DWLQJV DT WT9 HhvA8vA9hvTprA9vqrAAhqA8r 9hvTprA9vqrAAhq Wyhtr WBTA2AAWADTA2A!#A6AAAAAAAAAIrA! '$ !# ! 6 W Notes: 1: RJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. a) 50 C/W when mounted on a 1 in2 pad of 2 oz. copper. b) 105 C/W when mounted on a 0.04 in2 pad of 2 oz. copper. c) 125 C/W on a minimum mounting pad. Scale 1 : 1 on letter size paper 2: Pulse Test: Pulse Width 300 s, Duty Cycle 2.0% SI9430DY Rev. A SO-8 Tape and Reel Data and Package Dimensions SOIC(8lds) Packaging Configuration: Figure 1.0 Packaging Description: EL ECT ROST AT IC SEN SIT IVE DEVICES DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S TNR D ATE PT NUMB ER PEEL STREN GTH MIN ___ __ ____ __ ___gms MAX ___ ___ ___ ___ _ gms Antistatic Cover Tape ESD Label SOIC-8 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 units per 7" or 177cm diameter reel. This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. Static Dissipative Embossed Carrier Tape F63TNR Label Customized Label F852 NDS 9959 F852 NDS 9959 F852 NDS 9959 F852 NDS 9959 SOIC (8lds) Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 2,500 13" Dia 343x64x343 5,000 0.0774 0.6060 L86Z Rail/Tube 95 530x130x83 30,000 0.0774 F011 TNR 4,000 13" Dia 343x64x343 8,000 0.0774 0.9696 D84Z TNR 500 7" Dia 184x187x47 1,000 0.0774 0.1182 F852 NDS 9959 Pin 1 SOIC-8 Unit Orientation 343mm x 342mm x 64mm Standard Intermediate box ESD Label F63TNR Label sample LOT: CBVK741B019 FSID: FDS9953A QTY: 2500 SPEC: F63TNLabel F63TN Label ESD Label (F63TNR)3 D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F SOIC(8lds) Tape Leader and Trailer Configuration: Figure 2.0 Carrier Tape Cover Tape Components Trailer Tape 640mm minimum or 80 empty pockets Leader Tape 1680mm minimum or 210 empty pockets July 1999, Rev. B SO-8 Tape and Reel Data and Package Dimensions, continued SOIC(8lds) Embossed Carrier Tape Configuration: Figure 3.0 T E1 P0 D0 F K0 Wc B0 E2 W Tc A0 P1 D1 User Direction of Feed Dimensions are in millimeter Pkg type SOIC(8lds) (12mm) A0 6.50 +/-0.10 B0 5.30 +/-0.10 W 12.0 +/-0.3 D0 1.55 +/-0.05 D1 1.60 +/-0.10 E1 1.75 +/-0.10 E2 10.25 min F 5.50 +/-0.05 P1 8.0 +/-0.1 P0 4.0 +/-0.1 K0 2.1 +/-0.10 T 0.450 +/0.150 Wc 9.2 +/-0.3 Tc 0.06 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 20 deg maximum Typical component cavity center line 0.5mm maximum B0 20 deg maximum component rotation 0.5mm maximum Sketch A (Side or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement SOIC(8lds) Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max Dim N See detail AA 7" Diameter Option B Min Dim C See detail AA W3 Dim D min 13" Diameter Option W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size 12mm Reel Option 7" Dia Dim A 7.00 177.8 13.00 330 Dim B 0.059 1.5 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 0.795 20.2 Dim N 2.165 55 7.00 178 Dim W1 0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0 Dim W2 0.724 18.4 0.724 18.4 Dim W3 (LSL-USL) 0.469 - 0.606 11.9 - 15.4 0.469 - 0.606 11.9 - 15.4 12mm 13" Dia (c) 1998 Fairchild Semiconductor Corporation July 1999, Rev. B SO-8 Tape and Reel Data and Package Dimensions, continued SOIC-8 (FS PKG Code S1) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0774 9 September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM DISCLAIMER ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. D |
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